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4054 Soldering Control of a soldering process must address the two premises previously noted First, the soldering process be it reflow soldering, vapor phase soldering, or manual soldering must nominally be capable of making every joint on the printed circuit board without damage to the components or the laminate materials Second, the soldering step must perform the assembly process repeatedly to meet product quality (defect) specifications Although the first premise seems intuitive, it must be recognized that some circuit board products may simply be outside the process capabilities of some equipment or manual capabilities, no matter the degree to which the machine parameters or operator actions are optimized For example, in the case of manual soldering, it becomes increasingly more difficult to make a satisfactory joint when a multilayer circuit board exceeds approximately 24 mm.

The soldering iron cannot provide sufficient heat to the joint structure to support wetting and spreading by the molten solder without causing thermal damage to the component or the Cu pad A similar circumstance can come to pass with automated soldering process equipment Generally, with the increased thickness and/or complexity of the circuit board as well as with the increased mix of components, the gap widens between the process requirements of the product and the process capabilities of the equipment or operator There are two possible solutions to this discrepancy: Either a capital investment can be made to upgrade the equipment (if available) to assemble the product successfully, or the primary assembly process must be limited to those components having similar geometries and thermal characteristics The remaining devices are then treated as odd-form components and are soldered to the circuit board using secondary processes (eg.

x = 1

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, selective soldering or manual assembly) There are ancillary measures that can be taken to enhance the capability of a soldering process For example, in the case of manually soldering components to a thick circuit board, the latter may be preheated to augment the heat input of the soldering iron Similar approaches have been used for selective soldering, particularly when both the component and the circuit board are thermally massive However, these ancillary steps must be thoroughly investigated prior to implementation First of all, these added steps not only impact the production throughput, but they may also affect the defect rate of the next-assembly process For example, excessive preheating of a circuit board can degrade the solderability of the other pad features or cause thermal damage to vias or the underlying laminate material.

Second, to maintain minimum defect rates for the assembly, these ancillary process steps must be as tightly controlled as the primary soldering processes Lead-free assembly generates an increased concern for the nominal process to make all of the solder joints on a circuit board The issue has less to do with the ability of the actual equipment and fluxes to accommodate the high process temperatures than it has to do with temperature gradients across the circuit board versus the temperature sensitivity of components..

FIGURE 40.29 Schematic diagram illustrating the available process window for the Sn-Ag-Cu Pb-free solders (having melting temperatures of 217 C) referencing the typical reflow process time-temperature profile.The 230 C mark is the minimum process temperature to ensure adequate solderability. Temperatures exceeding 245 C increase the likelihood of thermal damage to larger plastic-molded area-array and flat-package devices. Temperatures above 260 C increase the chances of thermal damage to smaller passive devices (e.g., chip resistors, capacitors, inductors, and filters) and the circuit board structures (e.g., vias) and laminate material.

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This point is illustrated by the schematic diagram in Fig 4029, which pertains primarily to the reflow process and typical time-temperature profiles A minimum temperature of 230 C is required to ensure adequate wetting and spreading by the Pb-free solder on circuit board pads as well as on component leads and terminations Temperatures exceeding 245 C increase the likelihood of thermal damage to larger, plasticmolded packages (eg, BGA and QFP devices) When temperatures exceed 260 C, there is the potential for thermal degradation of passive chip components (chip capacitors, inductors, or filters) as well as to circuit board structures (eg, vias) and laminate materials In the case of Sn-Pb eutectic solder that melts at 183 C, the minimum process temperature of 215 C ensures adequate solderability, which is 15 C lower than that of a nominal Pb-free process.

Relation between Supply Pressure, Ps and Pocket Pressure, PR For design conditions, the relation between the supply pressure and the pocket or recess pressure is taken to be PR = PR =

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