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Defects Defects are defined as those artifacts that are outside the window of acceptable attributes for the finished circuit board assembly. Thus, defects are not limited to the solder joints, specifically, but can also include damage to the circuit board material as well as degradation to component structures (e.g., molding compound, leads or terminations, etc.). Defect types and their allowable frequencies (often expressed in parts-per-million solder joints or product units) vary with the different assembly processes and applications. Therefore, product drawings, in conjunction with industry standards (e.g., IPC-610), are used to establish accountable defect types for printed circuit boards. Defects are most often detected by visual inspection or automated optical inspection (AOI). Other means of nondestructive evaluation (NDE) include electrical testing, x-ray inspection, and ultrasonic inspection. The preferred NDE inspection technique for BGA and CSP solder joints is x-ray inspection. Automated x-ray inspection equipment is often placed directly into the assembly process line for circuit board products having a large number of area-array components. vb.net data matrix code VB . NET Data Matrix Generator generate, create 2D barcode Data ...
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NET ; Generate Data Matrix in Reporting Services using C#, VB. NET ; Professional . NET Barcode Generator component supporting all kinds of barcode settings ... There are destructive evaluation techniques that can also be used to find defects Metallographic cross sections provide a means to inspect the internal structures of the solder joints, components, and circuit boards, albeit in only a single plane at a time Mechanical tests (die shear, pull tests, etc) can also be used to identify defects However, because these approaches are destructive, and because they require long lead times to obtain results, they are generally inapplicable for real-time process control They are better suited for process development or failure analysis activities Defects serve two functions for the process engineer First, defects provide the quantitative metric with which to ascertain process control, using SPC techniques Second, the microstructural details of the defect(s) can be used in a failure analysis study to identify the root cause of an out-of-control process. java ean 13 generator, sap crystal reports qr code, zxing barcode reader java example, open source pdf library c#, rdlc qr code, rdlc ean 128 datamatrix.net documentation Best 20 NuGet datamatrix Packages - NuGet Must Haves Package
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27 Aug 2014 ... It turns out, adding -Source http://location.to/ nuget appears to work but this situation is not ideal... There is very little difference between the types of defects that occur during a Pb-free assembly process and those that have been documented for Sn-Pb assemblies The two exceptions are grainy solder fillets and fillet lifting of Pb-free, through-hole interconnections The grainy fillets resulting from the use of some Pb-free alloys are intrinsic properties of their solidification behavior Because they do not necessarily represent a cold solder joint that is, one that is only partially melted the appropriate revisions have been made to industry specifications to account for this effect The second phenomenon, fillet lifting, occurs on some Pb-free plated through holes Although several studies have concluded that fillet lifting does not necessarily impact either the short-term performance or long-term reliability of these interconnections, they may still be categorized as defects, depending on the particular product requirements. vb.net data matrix barcode Best 20 NuGet datamatrix Packages - NuGet Must Haves Package
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