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Dispensing defects can be detected by visual inspection or automated inspection techniques. Such automated techniques include those based on visible light images as well as laser profilometry that determines the actual volume of the adhesive or solder paste deposit. However, inspection slows the process assembly line. The more joints that are selected for inspection (that is, not all joints need to be inspected) and the greater the information detail required from of the inspection results (referring to the height profilometry data collection), the longer the delay in the process flow. It may be preferred that, on the detection of a dispensing defect, the board is cleaned of all adhesive or solder paste and the dispensing process repeated again. However, in other cases, it may be possible to correct isolated dispensing defects, such as the manual assembly of oddform components or when as many or more defects would be created by a redispensing step. The latter case is particularly pertinent for very dense circuit boards. 40.5.3 Component Placement Successful control of the placement process, whether a highly automated chip shooter step or the manual placement of odd-form components, must meet the following objectives:

Select the correct component for the designated circuit board location. Place the component at that location, in the proper orientation, and within the tolerances of the x, y, and z (height) coordinates as well as angular rotation specification. Minimize damage to the component being placed, the circuit board features, and nearby components. Minimize disturbing the dispensed adhesive or solder paste under the placed component prior to curing and reflow, respectively.

The resistance ratio governs most of the performance characteristics of the hydrostatic bearing For design purposes, the practical values of x can be considered to be in the range of 05 80 x = x =

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Important automated placement equipment factors are the stiffness of the support frame and positioning system, the geometry and size of the placement head (chip shooter or gantry architecture), as well as the capabilities of the camera and vision system. The machine frame must be sufficiently stiff to withstand the accelerations and decelerations of the placement heads, which are becoming heavier to accommodate more part types to reduce changeover intervals. The configuration of the placement head must not cause damage to neighboring components nor disturb already-dispensed adhesive or solder paste. Vision system capabilities resolution and field of view and associated software are a trade-off between information gathering and component placement speeds. Linear motors can achieve placement accuracies of 5 to 10 m. The required degree of accuracy is a function of the size of the I/O (either lead, ball, or termination geometry) and the size of the circuit board pads on which the part is to be placed. Although it is preferred that the entire termination be centered on the pad footprint, this is not a practical objective due to tolerance build-ups. Errors are designated by the individual x and y linear (offset) coordinates, together with the rotational offset. In general, industry standards have allowed I/O-topad offsets of between 50 percent and 25 percent depending on the class of electronics (i.e., consumer electronics to high-reliability military and space assemblies). Placement errors can also be expressed by a single parameter, the lead-to-pad (LTP) ratio, which is calculated by an equation based on the x, y, and rotational offsets. The LTP is typically computed for the one

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lead that is most impacted by the machine error, resulting in a single LPT value per component typeAn industry standard is available (IPC-9850) that provides a methodology by which to compare the placement accuracies of different machines Statistical process control can be used to establish the placement performance of a particular machine and the components for a specific circuit board product As noted previously, placement defects can be identified in the machine by automated inspection Alternatively, such defects may be detected by a separate machine inspection station or through visual inspection A trade-off must be made between the number of parts inspected and detail of that inspection on the one hand, and the assembly process flow on the other The more information that must be processed by the inspection step, the slower the placement process Finally, every attempt is made to correct placement defects prior to the soldering step.

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